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Stacey Yemin Tang   (#39)   

Basic Information

Ann Arbor, MI
Email Address
University of Michigan
PhD Student

Ann Arbor, MI  

Personal Information

Additional Information

COE EECS - ECE Division
Advanced Materials, Processes, and Packaging




Seeking an engineering research position in industry related to design, development, testing and prototyping of novel and unique MEMS Sensors and Microsystems.


    University of Michigan, Ann Arbor, MI

                Ph.D. Candidate, Electrical Engineering (Expected December, 2016)

                Thesis Advisor: Professor Khalil Najafi

    University of Michigan, Ann Arbor, MI

                M.S.E. Electrical and Computer Engineering (December 2013)

                GPA: 3.96/4.00

    University of Michigan, Ann Arbor, MI

                B.S.E. Electrical and Computer Engineering (May 2011)

                GPA: 3.77/4.00

               Eta Kappa Nu Electrical Eng. Honor Society


  1. Y. Tang, K. Najafi, “High Aspect-Ratio Low-Noise Multi-Axis Accelerometers Made from Thick Silicon,” in 2016 IEEE International Symposium on Inertial Sensors and Systems, Laguna Beach, California, pp. 121 – 124, February 22-25, 2016. (Oral Presentation)
  2. Y. Tang, K. Najafi, “A Two-Gap Capacitive Structure for High Aspect-Ratio Capacitive Sensor Arrays,” in 2015 IEEE International Electron Devices Meeting (IEDM), Washington, D.C., pp.18.2.1 - 18.2.4, December 7-9, 2015. (Oral Presentation)
  3. Y. Tang, R. L. Peterson and K. Najafi, “Technology for fabricating dense 3-D microstructure arrays for biomimetic hair-like sensors,” in 2013 IEEE Int. Conference on Micro Electro Mechanical Systems (MEMS), Taipei, Taiwan, pp. 355-358, January 20-24, 2013. (Poster Presentation)

Project Experience

  • Ph.D. Thesis: 3-D Biomimetic Hair-Like Low-Noise High-Sensitivity Multi-Axis MEMS Accelerometer and Arrayed Accelerometer/Transducer Platform (on-going)
    •  Microelectromechanical (MEMS) Accelerometer DesignModeled in COMSOL Multiphysics a novel design of 3D biomimetic hair-like MEMS accelerometer. Optimized the design of the capacitive accelerometer to achieve sub-µg (<1µg/vHz) low-noise high-sensitivity (>0.1pF/g/mm2) capacitive accelerometer. Validated the FEA simulation results by analytical derivations and experimental testing of in-house microfabricated accelerometer chips
    •  Accelerometer Readout and TestingTapeout front-end IC (switched-capacitor SC charge integrator) in TSMC 180nm technology for high-resolution capacitive accelerometer readout. Performed electromechanical characterization on 1) shaker table AC testing from 0.1g to 30g over a wide frequency range, and 2) optical dividing head for -1g to +1g low-level DC acceleration testing.
    •  High-Yield Microfabrication Technology Development and Cleanroom Experience: Developed a CMOS-compatible high-yield microfabrication process. Gained extensive cleanroom experience in silicon and metal processing. Achieved in-depth knowledge of microfabrication principles and tool operations in cleanroom.
  •  EECS 413 Monolithic Amplifier Circuits (group): Operational Amplifier Using Nested Miller Compensation
    •  Designed, simulated and layout an operational amplifier with 2.13MHz GBW by using nested miller compensation (NMC), a feedforward transconductance stage and a nulling resistor
  •  EECS 514 Advanced MEMS (group): Implantable Piezoelectric Energy Harvester from Lung Motion
    •  Designed and modeled a biocompatible PVDF microfiber reticulate structure to harvest energy from lung motion that operates at low frequency (1-2 Hz) and delivers nW of power.
  •  EECS 515 Integrated Microsystems (group): A Smart Drug Delivery System with Spatial and Temporal Control of Drug Release to Prevent Restenosis in Coronary Stents
    •  Designed a smart drug delivery system on flexible PCB attached to stent with MEMS sensor feedback to deliver anti-proliferation drugs to  locations where restenosis begins
    •  Modeled an electrostatically actuated Polypyrrole valve for controlled drug release through aperture
    •  Studied and simulated by COMSOL a switch-mode polyimide pressure sensor to detect plaque growth
  •  Graphical User Interface for Radioactive Material Detection (Fall 2011)
    •  Acquired and analyzed data preprocessed by FPGA that contained information on the gamma rays and neutron component of radioactive materials from PCI interface
    •  Created GUI to display the properties of the materials, using C++
  •  Characterization of Ink-jet Printing for Wafer Bonding/Sealing of a Miniature Gas Micropump (Summer 2010)
    •  Identified appropriate sealant on various substrates, aligned and deposited the sealing polymer onto specific pattern
    •  Developed the ink-jet printing technique for a sealing polymer (SU8-based) on Dimatix Inkjet Printer
    •  Tested the effectiveness of the new sealing methods using SEM and etc.



Thin-film metal processing, deposition/oxidation, photolithography, dry and wet etching, bonding (Si-Glass anodic, Si-Au eutectic, thermal compression, flip-chip), metrology (SEM, EDS)


Design and Simulation Software

MATLAB, COMSOL, CoventorWare, SolidWorks, Tanner L-edit, Cadence, C++/C, LabVIEW


Interpersonal and Communication

Public speaking and presentation skill gained at various academic conferences;

Teamwork experience from PhD research projects and class projects throughout  undergraduate and graduate studies. 



Engineering Graduate Symposium (EGS) Technical Session Award, University of Michigan (2014)

Dean’s List, University Honors, University of Michigan (2009-2011)

Dean’s List, Shanghai Jiao Tong University (2007-2009)

Excellent Academic Scholarship, Shanghai Jiao Tong University(2007-2008)

Copyright © 2016
Wireless Integrated MicroSensing & Systems (WIMS2)
University of Michigan, College of Engineering
2300A Electrical Engineering and Computer Science Bldg.
1301 Beal Ave., Ann Arbor, MI 48109-2122

Phone: 734-763-2126
Fax: 734-647-2342